SN74AVC4T234ZSUR & TXB0102YZPR - Under Bump Metallization (UBM)

Crystal Kwong

Prodigy 70 points

We need the dimension A - Under Bump Metallization (UBM) for the part of SN74AVC4T234ZSUR & TXB0102YZPR

over 9 years ago

0 Crystal Kwong over 9 years ago

Prodigy 70 points

We also need the dimension A - Under Bump Metallization (UBM) for the part of TXB0102YZPR.

0 Jonathan Valdez over 9 years ago in reply to Crystal Kwong

TI__Genius 16450 points

Hello,

I'm looking into this for you and should have an answer for you soon.

0 Jonathan Valdez over 9 years ago

TI__Genius 16450 points

Hello,

For the SN74AVC4T234ZSUR, dimension A= 0.25mm diameter

FOr the TXB0102YZPR, the solder bump is defined by an under bump metal pad (somewhat similar to graphic below, but not exactly) and has a diameter of 0.21mm.

0 Crystal Kwong over 9 years ago in reply to Jonathan Valdez

Prodigy 70 points

Hi Jonathan, Thank you very much!

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SN74AVC4T234ZSUR & TXB0102YZPR - Under Bump Metallization (UBM)