We are having a problem on our motherboards with 74CBTLV3126 On RGY PACKAGE. We are observing solder joints cracked.
This part is being placed on the center of the board (17" x 20") which has a significant board bending due to board size, thickness and weigth.
We saw an application note from TI indicating RGY packages are suceptible to substrate/pacakge damage in aplications like mine, but not sure if you have seen solder joints cracked but not RGY package damaged.
For instance, once we get this solder joint crack issue, if we rework these parts by removing and putting back the same part then our problems seems to go away.
