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Reliability of NiPDAu vs Sn lead finishes - what are the latest TI data for SOIC and TSSOP packages? High reliability?

Other Parts Discussed in Thread: CD4051B

I am looking at package/lead finish requirements for the CD4051B Mux/Demux to understand production volume sourcing challenges.

I am unclear regarding the 2015 state of reliability vs. lead finish, having seen mixed TI documents covering a long time period (2003 TI presentation stating a definite reliability advantage of NiPDAu over Sn primarily regarding tin whiskers, current Quality page has a 1Q2005 date for conversion of SOIC & SSOP packages to NiPdAu, then a couple of 2013 ECN's for alternate devices which suggest no measurable difference.).

The most popular reel part numbers in distribution are ones that are mixed lead finishes (BM96 for SOIC and BPWR for RSSOP).


Are there other data that I may be missing to understand if there is near reliability parity based on the past couple of years' SMT solder process/paste/PCB surface finish developments? 

Any feedback or pointers for sorting it out are appreciated.  Thanks.


-NanoAdam