Hello,
We are having failures in production with the YZP package. SN74LVC2G32YZPR is the part number.
It happens after reflow. The CM is using a water soluble paste. So, the board is washed. The solder balls stay on the board, but the glass falls off. I'm guessing we need to use a no clean paste, but I don't see that in the documentation. Is that correct?
Thank you
