Can the thermal pad of the TXB0108RGYR be grounded?
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Can the thermal pad of the TXB0108RGYR be grounded?
OE can be controlled by 3.3V. The VIH (min) and VIL (max) logic levels are set by VCCA, but the pin will be tolerant up to 5.5V as shown in the VIH max spec.
I'm seeing some strange behaviour on the TXB0108RGYR. Setup:
1. GND (pin 11) and PAD are connected to GND.
2. VCCA is 1.8V.
3. VCCB is 3.3V.
4. A 3.3V output is connected to B1 (pin 20 - CH1). A 1.8V input is connected to A1 (pin 1 - CH2).
As you can see, the 1.8V output is not clean. The enable is at 3.3V for the entire pulse.
For anyone interested: the TXB does not actively hold outputs at 0 or 1. Only the edges are accelerated through one-shots. The input above has a pullup, and it contends with the TXB's pulldown at logic level 0. The TSX0108E has a Npass FET that connects the input to the output at logic level 0, and provides a much cleaner output (low-output is around 60mV).
Hello Inderjit,
I'm sorry I was not able to reply to your earlier post sooner, but it looks like you were able to come to the recommended solution.
For applications that require pull-up resistors - the TXS0108E is the best choice.
It is not recommended that you use TXB translators with pull-up or pull-down resistors, unless they are at least 50kOhm.
The TXB device does have a weak drive (4kOhm) that will hold the output at 0 or 1. However, if you have a pull-up, (in this case it looks like ~15kOhm?), it will contend with the internal TXB buffer, and exhibit the behavior you show in your scope capture.
I've included a link below to an applications note that details using TXB translators.