Hi Sir,
Could you please help to check below stencil pattern is suitable for SN74LVC07A?
Thanks
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Hi Sir,
Could you please help to check below stencil pattern is suitable for SN74LVC07A?
Thanks
The datasheet refers to QFN and SON PCB Attachment (SLUA271), which says in section 4.4:
It is good practice to minimize the presence of voids within the exposed pad interconnection. Total elimination is difficult, but the design of the exposed pad stencil is crucial. The proposed stencil design enables out-gassing of the solder paste during reflow and also regulates the finished solder thickness. Typically, the solder-paste coverage is approximately 50% to 70% of the pad area. Designing an aperture that prints solder 1:1 with the exposed pad results in excessive metal volume that can "float" the part and cause opens and other manufacturing defects.
Hi Anne,
I am not clear on your pictures. I believe you are showing the stencil design from the some appnote or datasheet from TI? If you want me to compare it to your board, I cannot because there are no measurements written on your board diagram.
Please clarify the images.
Thanks!
-Karan