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SN74LVC2G17: Thermal resistance data required

Part Number: SN74LVC2G17

Hi 

We are using the part "SN74LVC2G17MDCKREP" in our design. We require the following details for thermal analysis

  1. RθJC - Thermal resistance between Junction to Case 
  2. RθJB - Thermal resistance between Junction to Board

  3. RθJA - Thermal resistance between Junction to Ambient
  4. Power dissipation of ic under typical,minimum and maximum conditions

These data were not specified in the data sheet.kindly help us to get the details asap.