Hi
We are using the part "SN74LVC2G17MDCKREP" in our design. We require the following details for thermal analysis
- RθJC - Thermal resistance between Junction to Case
-
RθJB - Thermal resistance between Junction to Board
- RθJA - Thermal resistance between Junction to Ambient
- Power dissipation of ic under typical,minimum and maximum conditions
These data were not specified in the data sheet.kindly help us to get the details asap.