LSF0108: Query on Thermal Pad

Shashank Meti

Part Number: LSF0108

Hi,

My customer is using LSF0108RKS Bidirectional Buffer. They are using all 8 lines and the maximum drive strength used will be 4mA per line.

They have already provided isolated center pad with Cu thickness 1.8mils to solder the thermal pad. Is it necessary to provide vias on the thermal pad, and provide plane in inner layers? Please advice here. They are using a 16 layer stackup.

over 5 years ago

0 Clemens Ladisch over 5 years ago

Guru 316690 points

8 × 20 Ω × (4 mA)² ≈ 2.5 mW

2.5 mW × 49.3 °C/W ≈ 0.1 °C

It's called "thermal", but the pad has no practical thermal effect for this device.

0 Shashank Meti over 5 years ago in reply to Clemens Ladisch

TI__Intellectual 1010 points

So they can just solder to one plane & need not provide Vias to other grounds?

0 Clemens Ladisch over 5 years ago in reply to Shashank Meti

Guru 316690 points

It would make no difference.

Logic

Logic forum

LSF0108: Query on Thermal Pad