SN74LVC8T245: SN74LVC8T245RHLR: A questions about the thermal pad of VQFN - 1 mm footprint.

Hi

I use SN74LVC8T245RHLR with VQFN footprint (package drawing RHL ) in my design. This footprint has a big thermal pad, but there is little information about how to handle this thermal pad----The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.  I just want to know whether this thermal pad can be connected to the GND plane (A plane with a GND net, not a no connected net just for thermal)?

Regards