SN54LVTH162244-SP: package information required for thermal analysis

Hi,

Unfortunately we cannot provide the information requested above. What kind of thermal analysis are you looking to run on our part?

Thanks!

Chad Crosby

Hi,

we are using this device in our circuit/pcb.

to check junction temperature of this device in our application layout condition, we need this information to model this device's package.

Hi,

Would this device's thermal resistance & thermal characteristics (theta ja, theta jc, etc.) be sufficient? 

Thanks!

Chad Crosby

Hi,

theta-jc information is useful and we are using this in our analysis.

But to find thermal behavior between case-to-ambient, theta-ja is required which is application dependent and datasheet information can not be used. Our circuit environment is vacuum.

for complete analysis, we need all information which are asked in original query.

Hi,

If you think having the Theta JC value would be beneficial to your thermal analysis, I can put in a request to have it done (usually takes up to 2 weeks)

Would you like me to do this?

Thanks!

Chad Crosby

Hi,

Thanks for reply,

Theta-JC information available with me, we are already using this information in our analysis.

Theta-JC information is already available in device datasheet.

for further analysis, we need more information (like weight and others....) as asked in first original query.

kindly help.

Hi,

I see. As I said earlier, I can't provide that information to you unfortunately.

I'm going to go ahead and close this post.

Thanks!

Chad Crosby

Hi,

that's unfortunate for not getting asked informaton for such high performance established TI device.