Hi guys.
I'd like to ask about the thermal pad of the LSF0108RKSR. In the datasheet (page 30) is mentioned that the RKS "incorporates an exposed thermal pad that is designed to be attached directly to an external heatsink. The thermal pad must be directly soldered to the printed circuit board".
In this forum, it is said that "The thermal pad may be connected to the ground plane or left floating". I'm not sure about put it as floating. I think the options are to connect that thermal pad to GND (which is not specified in the datasheet) , or to connect it to a copper section just to provide mechanical fixing. First, can it be connected to GND? if it can, which option would give the best performance in terms of heatsink effects.
thank you
