SN74AHCT244: SN74AHCT244MDWREP

6314104

Prodigy 20 points

Part Number: SN74AHCT244

Hi TI,

please provide the following information for PN SN74AHCT244MDWREP.

Assembly site:

Wafer fab site :

Mold compound:

Lead frame finish:

Bond Wires:

Thanks,

Daniel Sowell

over 3 years ago

0 Chad Crosby over 3 years ago

TI__Expert 6680 points

Hi Daniel,

Please use TI's Material content search for this information. I cannot provide any additional information to what's available here.

Thanks!

Chad Crosby

0 Aaron Spaete over 3 years ago

TI__Expert 4290 points

Daniel,

Mold compound, wafer fab site and assembly site is very proprietary, so we can't have on e2e. What is available is Lead frame finish: https://www.ti.com/product/SN74AHCT244-EP

Under ordering and quality, it says NiPdAu.

Another good resource is the following page: https://www.ti.com/applications/industrial/aerospace-defense/technical-documents.html

At the bottom, under "additional supporting literature."

https://www.ti.com/lit/ml/sszb156a/sszb156a.pdf - "Understanding Quality Levels for High Reliability Rated Components

https://www.ti.com/lit/sg/sgzt005b/sgzt005b.pdf - EP selection guide has a really good table of what's covered.

Under it states that we use gold bond wires as part of the V62 spec.

Regards,

Aaron

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SN74AHCT244: SN74AHCT244MDWREP