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CD74ACT74: CD74ACT74M96 vs SN74ACT74MDREP

Part Number: CD74ACT74

Team, 

Customer was looking for info regarding the mold compound and considering this is only available via MIC, can we at least make the following statement?

They are trying to move from the non-EP to the -EP variant.  and are worried about the below.   

If asking the requested info is hard to achieve then could you confirm this statement:

Would you please provide us a statement that the Material Contents, Mechanical Properties, Vibrational Properties/Environment and Thermal Properties are the same between CD74ACT74M96 and SN74ACT74MDREP ?

Regards,

Aaron

  • Hey Aaron,

    Looking at the quality & reliability packaging data between the CD74ACT74M96 and the SN74ACT74MDREP it doesn't look like they would lose any reliability from upgraded. Rather, as expected from an upgrade, there would be more to gain. The FIT rate is lower (better) in the EP version, the bond wiring is gold, as you mention thought the mold compound does change but the results were better with the EP mold compound. The qualification summaries towards the bottom are identical as well and the performance across temperature will be the same as specified in the datasheet. 

    Hope this helps,
    Rami