First, the form did not recognize the part number - which I do have here.
I have a design that uses the CAHCT138QPWRG4Q1 device. I need to determine if this device is sensitive to Hydrogen such that any partial pressure > 10-100 ppm in the case would contribute to a reduction in performance. It will be used in MIL/Aero application and be in a hermetically sealed package. I don't see anything on the datasheet that states specifically. Can you provide any more info on this?
I see on this page the list of materials https://www.ti.com/quality-reliability-packaging-download/report?opn=CAHCT138QPWRG4Q1 I don't see any of the commonly affected materials such as Ti, GaAs, Pt, Pd, GaN, InP, But I do see Yt in the bond wire, I'm wondering if TI has any records of this sort of testing and any outcomes, or if there's an awareness of this type of technology being sensitive in general.
