Hello,
TI provides a thermal model for the AM263x.
see AM263_324ZCZ.ecxml
I just don't have a tool to work with ecxml files at the moment.
Would it be possible to share a Foster or Cauer model?
br,
Bernhard
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Hello,
TI provides a thermal model for the AM263x.
see AM263_324ZCZ.ecxml
I just don't have a tool to work with ecxml files at the moment.
Would it be possible to share a Foster or Cauer model?
br,
Bernhard
Hello Bernhard,
At this time, TI does not provide RC network models (Foster and Cauer) for BGA package and only provides the .ecxml thermal simulation model file. The ecxml model is a 3D geometrically accurate thermal model. The ecxml model is also the universal format for popular thermal simulation tools like Icepak and Flowtherm. Is there a particular reason that the RC network model is needed other than not having a simulation tool that supports .ecxml?
Thank you,
Erik