AM2634-Q1: can this part accept reflow it twice time?

Kai Lai

Genius 9751 points

Part Number: AM2634-Q1
Other Parts Discussed in Thread: AM2634,

Hi Team,

There is a SMT question from customer.

For the PCB board what customer design now, ICs will place at both PCB side

Can customer will first reflow the top side and our AM2634 will solder to the PCB board at this side(pass a high temp.)

Then after cool down, PCB will turn around and reflow another side, to the AM26 will pass another time high temp.

Customer is wondering, does our AM26 can pass the reflow high temp. twice time ?

They are also worried that the IC will drop at this moment.

AM2634BKNFHMZCZRQ1

Thanks!

Kai

over 3 years ago

0 Randy Rosales over 3 years ago

TI__Mastermind 18500 points

Hi Kai,

I would recommend you follow all normal manufacturing reflow requirements for the TI NFBGA packages like the AM263x MCU: https://www.ti.com/lit/an/spraa99c/spraa99c.pdf. If the proper baking procedures are followed for moisture removal and the temperature vs. time profiles listed in this application note are not exceeded, then the parts should be fine.

Regarding specific reflow order of operations, you will need to discus that with your selected fabricator. Depending on the timing and weight, even heavier parts can sometimes be held on by surface tension of the solder, but it is very situation dependent.

I hope that helps.

Thank you,

-Randy

0 Kai Lai over 3 years ago in reply to Randy Rosales

TI__Genius 9751 points

Hi Randy,

Thanks for your reply.

But which reflow picture should customer follow ?

There are two Recommended Reflow Profile :

Figure 4-2. Recommended Reflow Profile of Pb-Free nFBGA Package

Figure 4-3. Recommended Reflow Profile of Eutectic SnPb nFBGA Package

Which one should AM2634-Q1 follow?

Thanks!

0 Randy Rosales over 3 years ago in reply to Kai Lai

TI__Mastermind 18500 points

Hi Kai,

The current datasheet is not explicit on the topic of solder-ball composition. Let me check and get back to you. We target RoHS compatibility, so most likely this require the higher temperature/Pb-Free solder profile in manufacturing.

-Randy

0 Kai Lai over 3 years ago in reply to Randy Rosales

TI__Genius 9751 points

Hi Randy,

Sure, please let me know the update!
Thanks!

0 Randy Rosales over 3 years ago in reply to Kai Lai

TI__Mastermind 18500 points

Hi Kai,

It is not currently specified in the datasheet - but AM263x assembly should be targeting higher temperature/Pb-Free solder profile. This should be in a future update.

Thank you,

-Randy

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AM2634-Q1: can this part accept reflow it twice time?