AM2434: Device information checking

Jiaxin Xu

Prodigy 130 points

Part Number: AM2434

Dear team,

Pls help to check these information for AM2434.

It's very urgent for us to support customer's application.

Thanks

1.Does the MCU Chip include any of the following technologies?
a) Array packages equal to or less than 0.8mm pitch？
b) Ceramic BGA or Cu CGA component
c) Leadless area array component; such as QFN, MLF, LGA, etc.
d) Passives of case size 2512 or larger
2.If the answer to any item in 1 is yes, has solder joint reliability evaluation per IPC9701 on the technology component type(s) been completed?

over 3 years ago

0 Mike Pridgen over 3 years ago

TI__Mastermind 22835 points

Hi,

1a) Yes, AM2434_ALV and AM2434_ALX package options can be found in the package dimensions shown below:

AM2434_ALV
- (17.2mm x 17.2mm - 0.8mm pitch)
AM2434_ALX
- (11.0mm x 11.0mm - 0.5mm pitch)

1b) No, device is a Plastic Grid Array component.

Additional details can be found by filtering down to ALV and ALX package options in the link below:
- https://www.ti.com/packaging/docs/searchtipackages.tsp?packageName=BGA

1c) Mechanical Package Addendums for the ALV and ALX package options can be found in the links below:

AM243x_ALV Package - https://www.ti.com/lit/pdf/MPBGAU4
AM243x_ALX Package - https://www.ti.com/lit/pdf/MPBGAU9

1d) Yes, AM2434_ALV and AM2434_ALX package options support passive component sizes of 2512 and larger.

2a) The "Board Level Reliability Primer for Embedded Processors" App Note can be downloaded at the link below:

https://www.ti.com/lit/pdf/spraby2

Additional information regarding package reliability can be found in the links below:

Thanks,
Mike

Arm-based microcontrollers

Arm-based microcontrollers forum

AM2434: Device information checking