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Hi team,
MSPM0 G-Series MCUs Hardware Development Guide (slaae76a) states that "TI recommends connecting a combination of a 10-μF and a 0.1-nF low-ESR ceramic decoupling capacitor to the VDD and VSS pins Higher-value capacitors can be used but can impact supply rail ramp-up time." on page 2, below Note.
However, in Figure 1-1 and Figure 2-3, 10uF and 0.1uF are connected.
Which statement is correct?
Best regards,
Kurumi
Hi Kurumi,
Thanks for pointing this out. Please use 10uF and a 0.1uF (100nF) bypass capacitors.
Best Regards,
Brandon Fisher
Hi Brandon,
Understood, I'd appreciate it if you could fix the datasheet.
Best regards,
Kurumi