AM2432: Conformal Coating

Hello Igor,

• TI does not have a recommendation for any specific conformal coat or underfill product.
• In some temperature ranges these materials can be detrimental if the conformal coating or underfill product has a mismatched CTE vs. solder joint (Z axis).  This mismatch combined with modulus of the material at certain temperatures can actually shorten the service life. 
• Due to this the customer should evaluate the performance of the underfill/conformal coating materials at an assembly level for the intended mission profile.

We are aware that some of our customers put chemical overcoating on our devices after PCB assembly for reasons such as moisture protection or security protection but as a semiconductor vendor, we do not evaluate those materials. As such we do not have a recommendation either way on using or not using such a material in your system.

One good source for overviewing the pros and cons of different materials can be found under this webinar.  https://www.dfrsolutions.com/hubfs/Resources/services/Coatings-and-Pottings-Issues-Challenges-and-Consortium.pdf

Best Regards,

Zackary Fleenor