MSPM0L1105: When will the BGA package be released?

SY Yoon

Genius 3381 points

Part Number: MSPM0L1105

Hi,

There are 6 packages in the datasheet except BGA.

Does TI have plan to make BGA package?

If TI has plan, when will it be released?

The ST's WLCSP package is very small. I wish TI supported a very small package that could replace this.

+1 Xiaodong LI over 2 years ago

Hi Yoon

We have plan to support BGA package.

On schedule, please contact with local field team.

May I know the pin-count of ST's WLCSP package and which ST P/N you can see on the project?

Thanks!

0 SY Yoon over 2 years ago in reply to Xiaodong LI

Genius 3381 points

Hi,

I don't have a project and part.

But I searched because I heard that ST supports a small package.

STM32L0 and STM32G0 series support various pin number of WLCSP package, and I think these can be competitor for MSPM0.

For example, STM32G051F has 18pin WLCSP package. This package size is 2 x 2.5.

I will explain TI's BGA plan in a customer who wants a small package.

Thank you for your support.

0 Xiaodong LI over 2 years ago in reply to SY Yoon

Hi Yoon

Thanks for your sharing and comment

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