TM4C123GH6ZXR: BGA Fanout - ZXR package

Robert Valentine

Part Number: TM4C123GH6ZXR

Hello,

I'm trying to grasp the best fanout approach for the ZXR BGA package and all I can come up with is that uVias (blind vias) are requried for the fanout of the inner balls. Does TI have a recommended fanout document or recommendation for the fanout for this part? The pitch is 0.5mm so the options are quite limited. I would like to make sure that if there is a specific recommended approach I use it so cost isn't driven up during manufacturing unnecessarily.

Thank you

over 2 years ago

0 Charles Tsai over 2 years ago

TI__Guru**** 190806 points

Hi Robert,

The ZXR BGA package was redesigned using a laminate nfBGA package. This nfBGA package offers data sheet-equivalent electrical performance or better thermal performance. It provides the same X and Y dimensions as MicroStar BGA, and provides pin-to-pin and footprint compatibility. The nFBGA PCB land pattern and stencil recommendations have been updated to achieve better soldering results after extensive testing and evaluation.. It is also footprint equivalent to the ZXR.

Please refer to the below documents for details.

https://www.ti.com.cn/cn/lit/pdf/spmz864

https://www.ti.com/lit/pdf/swcz037

0 Chester Gillon over 2 years ago in reply to Charles Tsai

Guru 92251 points

Charles,

The https://www.ti.com.cn/cn/lit/pdf/spmz864 linked in your reply is about a change from the ZRB to NMR package. These are 157 pin BGAs with a 0.65 mm pitch between the solder balls.

Whereas this thread was about the ZXR package which is a 168 pin BGA package with a 0.5 mm pitch between the solder balls.

I found System Design Guidelines for the TM4C123x Family of Tiva C Series Microcontrollers which has section 3.4.3 157-Ball BGA Escape routing for the ZRB or NMR package. However, can't find a TM4C design guide for the escape routing for the 168-pin ZXR package which I think Robert was looking for.

0 Charles Tsai over 2 years ago in reply to Chester Gillon

TI__Guru**** 190806 points

Hi Chester,

Thanks for pointing out my mixup and what Robert is really looking for. The TM4C123 Design Guideline doesn't mention anything specific for ZXR escape routing. I hope the 157-Ball BGA Escape routing can also serve as a reference for ZXR.

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TM4C123GH6ZXR: BGA Fanout - ZXR package