Tool/software:
Hello,
I am trying to figure out the optimum decoupling schema for the TMS570LC4357. I found some info on the E2E forums and they recommend having 0.1uF on each power pin. My PDN analysis though doesn’t meet the requirement unless I add more HF caps (like 0.001uF).
I am trying to see if the TMS570LC4357 Die itself has some HF decoupling on board. I appreciate if you could enlighten me on this.
Thank you,
Tharaka Goonetilleke.
Hi Tharaka,
I am trying to see if the TMS570LC4357 Die itself has some HF decoupling on board. I appreciate if you could enlighten me on this.
I am not aware of that, whether internal die have HF decoupling or not. However, Hercules controllers (including TMS570LC4357) controllers just requires small 100nF (0.1 uf), low-ESR ceramic capacitors for decoupling.
And you can refer our standard schematics of Launchpad and HDK boards, all are using 0.1uF for decoupling.
TMDX570LC43HDK Development kit | TI.com
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Thanks & Regards,
Jagadish.
