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MSP432-DEBUGGERS: MSP432P401 malfunctions

Massa1
Expert 1075 points
Part Number: MSP432-DEBUGGERS


Tool/software:

Hi, all

A company is producting a medical equipment with MSP432P401MIRGCR.
The company already sold 300 equipments to a market.
Then two equipments returned becaused of mulfunctions.
All equipments are tested and verified on room temperature.
And two equipment occured errors on around 50 degrees Celsius.
On around 30 degrees, the equipments works well.
We found two fenomena.
1. Around 50 degrees, ADC value go up with same input signal.
2. Around 50 degrees, UART can not work correctly.
At normal state, UART recieves a data request and returns data thru UART.
But around 50 degrees, MSP432 returns data asynchronously with host request.
Then the host computer announces time-out errors.

Now, we know MSP432P was EOL, and we have no information about MSP432P401.
What was happened inside of MSP432P401, your guess?
And how to prevent the bad equipment to the market.
We want to know how to test the equipment to find bad one.
There are many functions and it's so difficult to examine all functions.

B. R.
Massa

  • 0
    TI__Guru**** 191906 points

    Hi Massa-san,

      Based on your description, I will suggest you first perform a ABA swap test to confirm that the problem traces to the MCU. If you confirm the problem is a malfunction MCU, please contact your local TI representative or you can follow the instructions on this TI customer return website on how to move forward. https://www.ti.com/support-quality/additional-information/customer-returns.html

    The A-B-A Swap Method is a simple cross check test, which can confirm the observed issue is not systemic.

    • A-B-A Swap Method
      (1) Remove the suspected component (A) from the original failing board.
      (2) Replace the suspected component (A) with a known good component (B) and check if the original board now works properly.
      (3) Mount the suspected component (A) to a known good board and see if the same faliure occurs on the good board.

    Step 3 is important because it helps us to exclude any possibility that the issue is caused by a systemic issue or the interaction of multiple slightly bad components on a good board.

  • 0 in reply to Charles Tsai
    Expert 1075 points

    Thank you Charles Tsai-san,

    I asked to the customer to have the ABA swap test.  Then we'll contact our TI represetative.

    And now, the customer want to know why the devices have been mulfunctioned then the devices temperature goes up.  Can you estimate why?

    Then they want to test to find mulfunctioned devices, because MSP432P401 was EOL and we can not get some refined or new devices.  We must use only many old stocked devices.

    Best regards,

    Massa.

  • 0 in reply to Massa1
    TI__Guru**** 191906 points
    Massa1 said:

    And now, the customer want to know why the devices have been mulfunctioned then the devices temperature goes up.  Can you estimate why?

    Hi Massa-san,

      I don't know the root cause of the failure. After the ABA swap test and if you confirm that failure is due to the MCU then you can return the device for additional tests on TI side.