Other Parts Discussed in Thread: MSPM0G3507, LP-MSPM0G3507
Tool/software:
Hi,
I have a new project using XMSPM0L2228PMR. But the XDS110 debugger can't connect to it. The following error is shown:
CS_DAP_0: Error connecting to the target: DAP Connection Error. This could be caused by the device having gone to low power mode. Try forcing an external reset.If the error persists, try forcing BSL, a Mass erase or a Factory Reset. Check device FAQs for more information.
To see the root cause, I run "Test Connection" from MSPM0L2228.ccxml and see the error:
This error is generated by TI's USCIF driver or utilities.
The value is '-615' (0xfffffd99).
The title is 'SC_ERR_SWD_PROTOCOL'.
The explanation is:
The target failed to see a correctly formatted SWD header. The
connection to the target may be unreliable. Try lowering the
TCLK setting before trying again.
It seems that XDS110 can't see the target MCU.
To identify what's wrong, I soldered another PCB with only VDD, GND, VCORE, VBAT, SWDIO, SWCLK, NRST pins connected. Bypass and bulk capacitors are also soldered. VBAT is connected to VDD. 3.0V is measured on VDD and 1.35V is measured on VCORE. Unfortunately, the error is the same.
I have rich experiences about MSPM0G3507 with RHB and PM packages. Both packages are working well in my projects and I never encountered this kind of SWD error. I also compared the pinout of G3507SPM with L2228SPM. The key pinouts are the same.
I have checked the circuit/pinout/soldering again and again... Now, I believe it might be a silicon bug of XMSPM0L2228SPMR. If so, the chip design team should be aware of this issue before mass production. If there is any workaround, please let me know.