Tool/software:
Hi Expert,
I am looking for clarification on which SDK to use for a new project that is based on an existing codebase which used an older TI MCU-PLUS-SDK (v8.05).
The only industrial comms feature previously used was the low level ethernet cut-through feature. This was achieved through the PRU/ICSS/EMAC peripheral with the PRU running the blackbox Ethernet/IP Firmware. My previous question was answered that this would still work for us if we changed application protocol to a non-Ethernet/IP (but still ethernet-based) protocol -- and indeed we do still want to use this feature.
However, it was noted that the CPSW could also be used for this. Is there any recommendation on using CPSW for low level ethernet-cut through vs the PRU/ICSS/EMAC as mentioned above?
Additionally, the INDUSTRIAL-COMMUNICATIONS-SDK claims to offer industrial communication perks and features, yet I do not know if it would be a good fit for our needs.
Does it make sense to migrate to the latest MCU-PLUS-SDK, or does it make sense to instead migrate to the INDUSTRIAL-COMMUNICATIONS-SDK?
Kind regards,
Jeff
