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AM2634: Recommended 8-Layer Stack up

TEMC
Intellectual 955 points
Part Number: AM2634

Tool/software:

Please Provide 8-Layer recommended Layer Stack-up, and also please provide Width and Spacings to match 50 ohms & 100 ohms impedance.
  • 0
    TI__Genius 10634 points

    Hi TEMC,

    Please see section 10 of the AM26x Hardware Design Guidelines document for information on layer stack.

    Regards,

    Brennan

  • 0 in reply to Brennan Hartigan
    Intellectual 955 points

    In the Hardware design guidelines, it is given for 6-layer stack up, we require 8-layer stack up

  • +1 in reply to TEMC
    TI__Genius 10634 points

    TEMC,

    For 8-layers, the guidance is similar:

    • Total thickness should be 62mil +/-10%
    • Layers 1 & 8 are top/bottom layer mounting and signal routing
    • Layers 2 & 7 are GND return planes
    • Layers 3 & 6 are embedded microstrip/stripline signal routing (or power routing)
    • Depending on which layer (3 or 6) is mainly power routing, the adjacent layer to the power routing should be an additional GND return plane on layer 4 or 5
    • The remaining layer can be used as embedded microstrip/stripline signal routing

    For example:

    1. Top layer mounting and signal routing
    2. GND return plane
    3. Embedded microstrip/stripline signal routing and power routing
    4. GND return plane
    5. Embedded microstrip/stripline signal routing
    6. Embedded microstrip/stripline signal routing
    7. GND return plane
    8. Bottom layer mounting and signal routing

    For layer thickness, follow recommendations for 62mil total thickness PCB - this can be found on any PCB vendor website.

    Width & spacings for impedance matching is also dependent on layer thickness and material. Refer to the hardware design guidelines document for reference.

    Regards,

    Brennan