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AM2431: FCCSP package

arif khan
Prodigy 100 points
Part Number: AM2431


Tool/software:

Does the Texas Instrument  FCCSP based package have an interposer between the silicon die and the solder bumps or are the solder bumps deposited directly onto the die itself? If an interposer is used, is it made of metal or is it an organic substrate? 

Thanks

Arif Khan