MSPM0G3507-Q1: is there a wetting channel design?

Tonyx.wu

Tool/software:

For M0G3507QRGZRQ1 (TI), which is in a 48-VQFN package, is there a wetting channel design? Please help confirm if the IC package is easy to solder. We need this for the verification of our new project.

M0G3507QRGZRQ1（TI）：48-VQFN封装，是否有润湿槽设计

请帮忙确认IC的封装是否易于上锡，我们新项目验证需要，谢谢！

over 1 year ago

0 Tonyx.wu over 1 year ago

Genius 4525 points

If there is no wetting groove design, please recommend materials of the same specification with a wetting groove design for me.

0 Helic Chi over 1 year ago in reply to Tonyx.wu

TI__Mastermind 26228 points

Do you mean the "Wettable Flank"?

MSPM0 has it.

Pease refer to datasheet https://www.ti.com/lit/gpn/mspm0g3507-q1

GENERIC PACKAGE VIEW RGZ 48 in page 103.

0 Tonyx.wu over 1 year ago in reply to Helic Chi

Genius 4525 points

1.M0G3507QRGZRQ1（TI）：48-VQFN封装，是否有润湿槽设计，wettable flank.

1.M0G3507QRGZRQ1 (TI) : 48-VQFN package, with or without wetting slot design, wettable flank.

如果没有润湿槽设计，请推荐一颗同规格的有润湿槽设计的芯片，麻烦给我具体的料号.

If there is no wetting groove design, please recommend materials of the same specification with a wetting groove design for me,

please give me a suitble part number.

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MSPM0G3507-Q1: is there a wetting channel design?