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AM263P4-Q1: The xSPI (8D) SFDP Boot Loader operation and process is not documented anywhere in the TRM

Part Number: AM263P4-Q1

Tool/software:

We are working on the AM263Px SoC and are trying to boot from OSPI flash using the XIP (eXecute In Place) feature. To enable this, the recommended boot mode is xSPI 8D SFDP. However, after reviewing Section 5.4 "Boot Modes" of the TRM, we could not find detailed information regarding the xSPI boot loader operation and process. While there is some documentation about OSPI 8S boot, it does not support XIP.

We would like to understand the xSPI boot mode and process in depth. Specifically, if we configure the boot switches to select xSPI boot mode:

  1. What does the ROM Bootloader (RBL) do in order to execute the image from OSPI flash?

  2. If we implement secure boot using a Secondary Bootloader (SBL), how does control transfer from the RBL to the SBL, and how is the SBL executed?

Regarding the SBL, we referred to Section 5.7.7 "R5 SBL Hand-off". We would like to confirm whether this hand-off mechanism is also applicable to xSPI 8D boot mode. Specifically, how is the SBL executed in XIP mode?
Does the entire SBL get copied into on-chip RAM and then executed, or is the SBL itself executed directly from flash using XIP, without being copied to RAM?

3) If my core is running at 300Mhz and if i use XIP which runs at OSPI flash speed which is 133Mhz, will there be any conflicts in time while executing instructions from OSPI flash (any timing related issues for instruction execution)