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TMS570LC4357: TMS570LC4357

Ibrahim Takhyane
Prodigy 10 points
Part Number: TMS570LC4357

Tool/software:

We are planning to use the TMS570LC4357 in a high vacuum environment. My concern is whether is required to consider a heat dissipation method for the microcontroller due to the absence of natural convection on that environment. Therefore we will only have radiation to ambient (Surrounding temperataure between -30 to +50ºC) and conduction from the component to the PCB. On your datasheet I am not seeing any considerations on the requirements for cooling it down but it is still something I would like to assure. 
Thank you 
Best regards,
Ibrahim
  • 0
    TI__Guru 69891 points

    Hi Ibrahim,

    Apologies for the delayed response! I was off for few days and didn't get time to work on this issue.

    The TMS570LC4357 datasheet provides thermal resistance characteristics for the BGA package. These values, particularly the junction-to-board thermal resistance, are critical for calculating heat dissipation through conduction to the PCB in your vacuum environment.

    On-Chip Temperature Monitoring
    The TMS570LC4357 has three on-chip temperature sensors for monitoring the junction temperature. The measurements from these sensors are routed to a MibADC for conversion to digital values. This allows the application to monitor the device temperature and take action if it exceeds the specification. Possible actions include logging the event, turning off peripherals, or slowing down clocks to reduce the junction temperature.

    • Sensor Locations: Temperature sensors 1 and 2 are located near the ADCs, opposite the pin A1 corner. Temperature sensor 3 is near the center of the device.

    During Single Event Latch-up (SEL) testing, the device was operated at an IC temperature of 125°C. The test was conducted with the kinetic energy of the ion specified for a vacuum environment. No latch-up events were observed under these conditions.

    --
    Thanks & regards,
    Jagadish.