TMS570LC4357: Package question

Kannan Sockalingam

Part Number: TMS570LC4357

Tool/software:

Interested in the TMS5704357BZWTQQ1. Is this BGA package vented or is the die encapsulated/potted?

0 jagadish gundavarapu 4 months ago

Hi Kannan,

Apologies for the delayed response, i am checking this internally and will provide my update as soon as possible.

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Thanks & regards,
Jagadish.

+1 jagadish gundavarapu 4 months ago in reply to jagadish gundavarapu

Hi Kannan,

Kannan Sockalingam said:
Interested in the TMS5704357BZWTQQ1. Is this BGA package vented or is the die encapsulated/potted?

Internal team confirmed that it is encapsulated only.

--
Thanks & regards,
Jagadish.

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