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MSPM0G1507: I have some questions about the datasheet.

Genius 3215 points

Part Number: MSPM0G1507

Tool/software:

Hi All,

I have some questions about the datasheet.

1.When a GPIO port is set as an open drain port, is there any problem if an intermediate potential is applied to the port? (Through-current flows, etc.)
2.The standard values for pull-up/pull-down resistors are described in the data sheet P. 41. Is there a regulation for min/max values?
3.The recommended values for capacitor capacitance are described in the data sheet P. 82, etc. Is this value an effective value?
4.Is there a regulation for the voltage rise time of the power supply terminal?
5.There are 3 types of component footprint data, A, B, and C. What is the difference between them?
6.Regarding question 5, is there a recommended value for the opening of the metal mask?
7.Regarding the BOR voltage, 0+ is 1.56~1.62 V, but the recommended operating voltage of the microcomputer is 1.62~3.6 V.
For example, if the BOR is released and the microcomputer starts operating when the power supply voltage is 1.56 V, it will operate outside the recommended voltage range. Is there any problem?
*In order to set the microcomputer voltage to 2.3 V this time, if the BOR is set to 1+ (2.15~2.32 V), there is a possibility that a reset occurs due to an instantaneous stop or noise.

Best Regards,

Ito

  • 1.When a GPIO port is set as an open drain port, is there any problem if an intermediate potential is applied to the port? (Through-current flows, etc.)

    ODIO has two status: output low and HighZ, input a 1.65V to highZ is ok.

    When output low, low side FET is short to ground, it's better to add a current limitation resistor between 1.65V and ODIO.

    2.The standard values for pull-up/pull-down resistors are described in the data sheet P. 41. Is there a regulation for min/max values?

    It's here: 7.10.1 Electrical Characteristics

    It's 40kOhm, not max/min value.

    3.The recommended values for capacitor capacitance are described in the data sheet P. 82, etc. Is this value an effective value?

    There is no valid parameter in this datasheet: https://www.ti.com/lit/ds/symlink/mspm0g1507.pdf

    Please check all the content that including P. xx.

    4.Is there a regulation for the voltage rise time of the power supply terminal?

    Pease refer to 7.6.1.1 POR and BOR

    5.There are 3 types of component footprint data, A, B, and C. What is the difference between them?

    Which three?

    6.Regarding question 5, is there a recommended value for the opening of the metal mask?

    It's depending on the manufactory.

    7.Regarding the BOR voltage, 0+ is 1.56~1.62 V, but the recommended operating voltage of the microcomputer is 1.62~3.6 V.

    BOR status doesn't support user operation.

    For example, if the BOR is released and the microcomputer starts operating when the power supply voltage is 1.56 V, it will operate outside the recommended voltage range. Is there any problem?

    No, after BOR, CPU starts running.

    *In order to set the microcomputer voltage to 2.3 V this time, if the BOR is set to 1+ (2.15~2.32 V), there is a possibility that a reset occurs due to an instantaneous stop or noise.

    Please refer to TRM 2.2.3.2 Brownout Reset (BOR) https://www.ti.com/lit/pdf/SLAU846 for detailed logic of BORx.

  • Hi Helic.

    Thank you for your reply.

    ODIO has two status: output low and HighZ, input a 1.65V to highZ is ok.

    When output low, low side FET is short to ground, it's better to add a current limitation resistor between 1.65V and ODIO.

    What happens if a normal GPIO is set to open drain instead of a 5V tolerant pin(ODIO)?

    Which three?

    Ultra Librarian for TI

    If there is a recommended design for a metal mask, please let me know.

    Best Regards,

    Ito

  • What happens if a normal GPIO is set to open drain instead of a 5V tolerant pin(ODIO)?

    SDIO acts as same as ODIO, but only support 3.3V max (Vdd)

    If there is a recommended design for a metal mask, please let me know.

    I don't think this is official from ti.com.

    You can refer to this device's datasheet, and there are spec's for footprint, then choose one from your Ultra Librarian for TI based on device's datasheet.

  • Hi Helic.

    Thank you for your reply.

    I don't think this is official from ti.com.

    I understand that it is not an official site because it is not ti.com.
    If possible, could you give me your opinion on the difference between A, B and C?
    I will not consider it as an official answer but as a reference.

    Best Regards,

    Ito

  • As you can see, A's pad is larger than C's pad.

    If you are using C footprint, it will require higher requirement for PCB factory soldering, and it's not easy for testing the PCB.

    And if your PCB size is not limited by the area, you can choose type A, because it's a little bit larger.

    I don't think type A, B and C will make any difference on hardware design.