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MSPM0G1107: Comparison of MSPM0SDK and Assembly

K.Z
Genius 3215 points

Part Number: MSPM0G1107

Tool/software:

Hi All,

My customer is coding the Renesas RA0E2 using assembly language, and it seems that the code size is about 80% of the 128 KB available.
In response, I am proposing the MSPM0G1107, but I am concerned about how much code size would be required if the software is developed using MSPM0 SDK, CCS, and TI-Clang.
Is there any documentation comparing the code size of assembly versus MSPM0 SDK?
If not, I would appreciate your general opinion on this matter.

Best Regards,

Ito

  • 0
    TI__Expert 4450 points

    Hi,

    They are programming their entire application in assembly?

    It's difficult to compare the code size because it will depend on the compiler optimization settings, and what functions are required.

    What is the application?

    -Matthew

  • 0 in reply to Matthew Komitsky
    Genius 3215 points

    Hi, Mattew,

    Thank you for your reply.

    Almost entire is written in assembly.
    The application is a thermal printer.

    To propose customer MSPM0G1107, it is necessary to indicate approximately that the code must fit within 128KB.
    While we could propose a 256KB product instead, it is not feasible due to its high price.

    I understand that making a clear comparison is impossible.
    For example, when writing the gpio_toggle_output sample in assembly-based and SDK-based approaches, can't we show that the assembly-based approach is approximately X% more efficient?

    While it's expected that code written using the SDK will be larger than assembly code,
    I want to demonstrate that it can still fit within 128KB.

    Best Regards,

    Ito

  • +1 in reply to K.Z
    TI__Expert 4450 points

    Hi,

    It more than likely would still fit. Compiler optimizations *could* even make it smaller than what they currently have.

    -Matthew