AM2432: Maximum Allowable Value of Mechanical Pressure (Clamping Force) to the Top of Package (ALV)

Hello Hideaki

Thank you for the query.

Let me check internally.

Please expect delay in response.

Regards,

Sreenivasa

Hi Sreenivasa,

Thank you for your reply. It would be helpful if we can receive an answer as soon as possible.

Thanks and regards,

Hideaki

Hello Hideaki

Thank you.

Understand. I have reached out to the experts. Will update when i hear from the team.

Regards,

Sreenivasa

Hello Hideaki

Please refer below inputs i received

This is in our FCBGA app note (pg 52). It looks like TI’s recommendation is 0.015 lbf per BGA ball.

 That same section has some details regarding heat sinks, but I’m not seeing anything too specific. Generally, the customer defines which TIM they should use as well as the design of the heat sink, so I think we can only give them pretty generic guidance.

Regards,

Sreenivasa

Hi Sreenivasa,

Thank you for your reply.  Do you mean that it depends on only number of balls ?  doesn't depend on a package material such like Metal rid or Plastic molded ?

ALV (Metal ridded)       441balls x 0.015 lbf = 6.615 lbf

ALX (Plastic molded)  293 balls x 0.015 lbf = 4.395 lbf

Are they correct ?

Regards,

Hideaki

Hello Hideaki

Thank you.

Let me check with the team internally and update on this.

Regards,

Sreenivasa

Hi Sreenivasa,

Thank you for checking with the team. Did you get any update ?

Regards,

Hideaki

Hello Hideaki

Thank you for following.

I have not received any inputs.

Let me follow-up and update.

Regards,

Sreenivasa

Hello Hideaki

Please see below updated guidance 

• 0.65mmp/0.8mmp (like ALV) à 19 g/solder ball
  • 441/ALV à 441 x 19g = 8379g

• 0.5mmp (like ALX) à 13 g/solder ball
  • 293/ALX à 293 x 13g = 3809g

Regards,

Sreenibasa

Hi Sreenivasa,

Thank you for checking it with the team.

It seems that it has become about three times larger than the value we received before.

They've asked us to provide the document or URL which describes the updated guidance as an evidence.

Could you provide them a document or URL ?

Thanks and regards,

Hideaki 

Hello Hideaki

Thank you.

I received over email.

I assume this is not what you are looking for - can you please confirm your requirement.

Regards,

Sreenivasa

Hi Sreenivasa,

There was the app note of guidance which you shared.-

Kallikuppa Sreenivasa said:

This is in our FCBGA app note (pg 52). It looks like TI’s recommendation is 0.015 lbf per BGA ball.

 That same section has some details regarding heat sinks, but I’m not seeing anything too specific. Generally, the customer defines which TIM they should use as well as the design of the heat sink, so I think we can only give them pretty generic guidance.

but this guidance has been updated and the values are big changed.

There is no document or web page which describes the updated guidance ?

Only designer or test engineer knows this ?

The customer needs the evidence if this updated guidance is correct and reliable.

Regards,

Hideaki

Hello Hideaki

Thank you.

Let me reach out to the team internally on the availability.

Regards,

Sreenivasa

Hi Sreenivasa,

Thanks. OK, we wait for it.

Regards,

Hideaki

Hello Hideaki

Thank you.

I am checking with the team.

Regards,

Sreenivasa

Sreenivasa,

Sorry for rushing you, but could you please update the status.

Regards,

Hideaki

Hello Hideaki

Thank you for following.

I have not heard from the team.

Let me follow-up.

Regards,

Sreenivasa

Hello Hideaki

I understand the inputs are based on simulations performed that could become an app note in the future.

The simulations are not available for sharing.

Let me know if you have some concerns.

Regards,

Sreenivasa