MSPM0C1104-Q1: ultrasonic welding

Jan Bock

Part Number: MSPM0C1104-Q1
Other Parts Discussed in Thread: AWRL6844

We are evaluating also and either laser welding of ultrasonic welding to close our plasting housing of our product.

Do you have any official statement or recommendation or opposite with regards to Ultrasonic welding (we know there are potential risk in such progress on electronic components) ?

17 days ago

0 Diego Abad Sajamin 16 days ago

TI__Mastermind 19012 points

Hi Jan,

I'm not too familiar with this approach. Let me consult with my team about it. However, is there an specific package the customer wants to evaluate this option for?

Best Regards,

Diego Abad

0 Jan Bock 16 days ago in reply to Diego Abad Sajamin

TI__Expert 3370 points

The exact package I don't have. So if they apply ultrasonic welding - is there any package option that is more robust. I found other e2es about this topic.

like this one:

CC2640: Risk of Damage if using Ultrasonic Welding

For our radar devices I got the following reply:

Test for ultrasonic welding not performed on (AWRL6844). These high frequency vibrations are not part of AEC-Q100 standard. The repercussions of this ultrasonic welding could possibly damage the BGA balls or a potential die crack itself.

Thanks
Jan

+1 Allan Webber 16 days ago in reply to Jan Bock

TI__Intellectual 1750 points

The same position would extend to all TI semiconductors where such a process step has not been assessed.

Arm-based microcontrollers

Arm-based microcontrollers forum

MSPM0C1104-Q1: ultrasonic welding