Part Number: MSPM0G3507
Hello,
I am trying to implement LIN communication using MSPM0G3507 as the LIN Responder, based on the TI example:
lin_responder_LP_MSPM0G3507_nortos_gcc
For the LIN physical layer, I am using this transceiver:
Infineon TLE7259-3 (datasheet: https://mou.sr/44GZThK)
My Hardware Connections
Between MSPM0G3507 and TLE7259-3:
| MSPM0 Pin | LIN Transceiver Pin |
|---|---|
| TX (PA10) | TxD |
| RX (PA11) | RxD |
| GND | GND |
| 5V supply | VS (Vcc) |
Between LIN Transceiver and LIN Bus (Master: S32K144EVB):
-
LIN → connected to LIN BUS line
-
GND → common ground
-
5V → common supply
Goal
I want to verify basic LIN communication:
-
Master (S32K144EVB) sends LIN header
-
MSPM0G3507 responds using the responder example
My Question
What are the minimum additional hardware or configuration requirements to ensure the MSPM0G3507 works correctly as a LIN responder with the TLE7259-3 transceiver?
Specifically:
-
Does RxD require an external pull-up to 3.3V?
-
Does EN pin on TLE7259-3 need to be driven HIGH by MSPM0?
-
Is any BUS termination or pull-up needed at the slave node, or only at the master?
-
Is WK pin required to be pulled up or tied high?
-
Are there any required decoupling capacitors on VS or BUS that must be added for reliable operation?
Software
Using TI’s default LIN responder example with:
-
Baud rate: 19200
-
Enhanced checksum enabled
-
Auto-baud enabled (default)
Any guidance on the minimal required hardware setup and signals needed for proper LIN operation would be very helpful.
Thank you!