TMS570LS0714: Clean process

The compatibility of a TI TMS570 MCU with a PCB washing or cleaning process primarily depends on the package type and whether it is a designated "Enhanced Plastic" (EP) or "Space EP" (SEP) variant. The specific assembly and sealing of the device package determine its resilience to moisture and cleaning agents. 

TMS5700714APZQQ1 is not EP or SEP package. It may not be designed to withstand aqueous or harsh solvent-based cleaning processes without risk of moisture ingress or other damage.