Part Number: AM263P2-Q1
Dear TI,
We are interested in products such as HSM (Hardware Security Module) solutions, including PCIe-based or appliance-type devices.
However, we understand that a single chipset alone may not fully satisfy the requirements of an HSM device.
Based on our understanding, it may be possible to build an HSM device using a combination of a Secure Element and an MCU.
Currently, we are looking for chipsets that can comply with FIPS 140 Level 3 requirements.
If no single chipset meets these requirements, we are exploring development approaches that can achieve FIPS Level 3 compliance using a Secure Element together with an MCU.
In this context, we contacted you because we understand that TI’s AM263P2-Q1 provides HSM-related functionality.
We are also aware that there are chipsets designed to meet the requirements for TPM implementations; however, our primary interest is in developing an HSM device or a PCIe-type HSM solution, rather than a TPM.
If there are any areas where you can provide technical guidance or recommendations, we would greatly appreciate your support.
