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INDUSTRIAL-COMMUNICATIONS-SDK-AM243X: Requesting SysConfig source for board_lpddrReginit.h and clarification on differences from DDR Config Tool v0.10.32 default

Akihiro Tamura
Prodigy 90 points

Part Number: INDUSTRIAL-COMMUNICATIONS-SDK-AM243X
Other Parts Discussed in Thread: SYSCONFIG

Hello,

We are using the AM243x Industrial Communications SDK v11.00.00.08 and have questions regarding the LPDDR4 initialization header file included in the SDK.

Background

We are currently using board_lpddrReginit.h (located at mcu_plus_sdk/source/drivers/ddr/v0/soc/am64x_am243x/) from the SDK as-is. We are evaluating whether we need to switch to a custom configuration tailored to our board (Winbond W66BP6NBUAFJ, 2Gb LPDDR4, single channel). To make that decision, we need to fully understand what parameters the SDK-provided file encodes.

Question 1: SysConfig source for the SDK-provided board_lpddrReginit.h

The header file includes the following comment:

* This file was generated with the
* AM64x SysConfig DDR Subsystem Register Configuration Tool v0.08.40
* Wed Feb 02 2022 16:59:34 GMT-0600 (Central Standard Time)

However, no corresponding .syscfg file is included in the SDK. Without it, the register values are not human-readable and it is very difficult to understand which DRAM timing/electrical parameters were assumed during generation.

Could you please provide the .syscfg file (or equivalent parameter list) that was used to generate board_lpddrReginit.h in SDK v11.00.00.08?

Question 2: Explanation of differences between the SDK file and v0.10.32 default output

We regenerated a header using the latest publicly available DDR Subsystem Register Configuration Tool v0.10.32 with default settings for LPDDR4 (16Gb density, 800MHz). We found differences compared to the SDK-provided file.

We are attaching:
  • The .syscfg used with v0.10.32 (default values)
  • The generated header from v0.10.32

Could you please explain the reasons for these differences? Specifically, we would like to know:

  • Whether the differences in the SDK file represent intentional tuning, bug fixes applied between tool versions, or something else
  • Whether the v0.10.32 output is considered more correct/up-to-date than what is shipped in SDK v11.00.00.08

Attachments

Thank you for your assistance.

  • 0
    TI__Guru* 94981 points

    Hi Tamura-san,

    you should always generate a DDR configuration file with the latest version of the tool for a new custom board.  The configuration in the SDK is specific to the EVM and may have been produced with an older version of the tool, which would not have current fixes and optimizations.  

    If you choose the EVM from the "Board Design" field in the tool, this will give you the configuration for the corresponding EVM

    I checked you v0.10.32 file.  It looks like this is the default configuration.  Please check the following parameters in the Winbond datasheet for possible changes:

    tRFCab, tRFCpb, tRPab, tRPpb, tWR

    Also, there is a README link in the tool for guidance on changing the parameters based on your datasheet.

    Regards,

    James