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AM263P4-Q1: AM263P4 soldering and reflow profile

Jayakeerthana P
Intellectual 275 points

Part Number: AM263P4-Q1
Other Parts Discussed in Thread: AM263P4,

Hi team,
   For the part AM263P4 ,please share the asssembly soldring or refloew profile


Regards
Jayakeerthana P 

  • 0
    Intellectual 275 points

    Please correct it to assembly soldering or reflow profile

  • 0
    TI__Mastermind 34663 points

    Hi Jayakeerthana,

    The AM263P4-Q1 uses an NFBGA (ZCZ) 324-pin package with a moisture sensitivity level of MSL Level-3-260C-168 HR [1]. This means:

    • Peak reflow temperature: 260°C maximum [1]
    • Floor life: 168 hours at ≤30°C / 60% RH after removal from dry pack
    • Reflow profile: Must comply with IPC/JEDEC J-STD-020 for moisture sensitivity Level 3 components

    Key Assembly Resources

    For PCB guidance specific to the AM263x family (refer to the AM263x Hardware Design Guide, Section on PCB Assembly [2].

    General Reflow Guidelines (per J-STD-020 for MSL-3, 260°C)

    Parameter Specification
    Peak temperature 260°C max
    Time above 217°C (liquidus) 60–150 seconds
    Ramp-up rate 3°C/s max
    Preheat/soak 150–200°C for 60–120 seconds
    Peak time (within 5°C of peak) 20–40 seconds
    Ramp-down rate 6°C/s max
    Note: The exact time-temperature curve values above are standard JEDEC J-STD-020 guidelines for this MSL/package classification. Always validate against your solder paste manufacturer's recommendations and your specific board thermal mass.

    (Excerpt from: AN-1126 BGA (Ball Grid Array) (Rev. C))

    Handling Requirement

    Since this is an MSL-3 device, if the dry-pack seal is broken for more than 168 hours, baking is required before reflow (typically 24 hours at 125°C per J-STD-033).

    1. AM263P4 Datasheet - Packaging Information
    2. AM263x Hardware Design Guide - PCB Assembly
    3. MSL Ratings and Reflow Profiles (Rev. A)
    4. https://www.ti.com/lit/an/snoa021c/snoa021c.pdf

    Best Regards,

    Zackary Fleenor