• State
  • Replies 1 reply
  • Subscribers 31 subscribers
  • Views 39 views
  • Users 0 members are here
Support feedback
Options
Options
Related

AM2634: AM2634 4-LAYER STACK UP

TEMC
Expert 1025 points

Part Number: AM2634

Hello,

We are planning to implement a 4-layer PCB stack-up for the AM2634 controller as part of our cost optimization efforts & Fab timelines. However, we understand that the recommended stack-up for this controller is 6 layers. 

Could you please review and confirm whether a 4-layer stack-up would be functionally suitable for this controller, considering its design and performance requirements? 

If a 4-layer stack-up is feasible, kindly share your recommended 4-layer stack-up configuration, including the layer arrangement and any specific design considerations or constraints we should follow. 

Your confirmation and recommendations will help us proceed with the design while optimizing PCB fabrication costs and Manufacturing timelines without compromising functionality or reliability. 

  • 0
    TI__Mastermind 25031 points

    Hi,

    Since AM2634 only features a 324-pin NFBGA in ZCZ package, please see the following explicit note from the AM26x design guide: 

    "Lower layer count stackups for the ZCZ package are likely possible, especially when considering partial signal fan-out designs. However, these have not yet been explored by TI."

    If you are able to provide a pin utilization table or similar graph, then we could look into an assessment, but without this information, we can only comment that it could be feasible but we have not internally tested this. If you are using a 4-layer stackup, the following is standard configuration: 

    Copper 1 (Top) Top layer mounting and signal routing

    Copper 2 Ground return plane

    Copper 3 Power routing

    Copper 4 (Bottom) Bottom layer mounting and signal routing

    Regards,

    Peter