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Hi,all
I have questions about the layout of TMS570LS3137, the dimention of the ball of BGA is 0.5mm,the distance between two balls is 0.8mm, can you recommend the width of trace and other clearance of design rules. I want to guarantee the productibility and reliability of the PCB.
Hello Jiaming,
I have forwarded your post to one of our experts. They will respond back soon.
Hi Jiaming,
For product, reducing the PCB cost is most important. PCB cost is affected by many factors, generally increasing in cost as:
1. Overall PCB area increases
2. As the number of layers increases
3. As the diameter of the through-via decreases
4. As the trace width decreases below 5 mils
6. As the space between metal features decreases below 5 mils
The selection of via size, land pad size, trace width and spacing depends on your board definition. In my HDK design, I use 5mils for trace width/spacing, 16RD8 for via, and 14mils for BGA land pad.
regards,
Qingjun
Thank you for your reply.
I use 16mil for BGA pad ,and 16mil for through-via ,and the distance between pad and via can be a little more than 5mil.