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TMS570 Fab info

Alan Day
Intellectual 920 points
Other Parts Discussed in Thread: TMS570LS20216, TMS570LS3137

Dear Sirs,

For my work I need information on the die size of the parts TMS570LS20216 and TMS570LS3137. In addition please confirm that these parts are fabricated using a 130nm and 65nm process respectively.  I've tried using "ASKTEXAS" however this question apparently falls outside of it's modus operandi.

Kind regards,

Alan

  • 0
    TI__Mastermind 23000 points

    Hello Alan,

    It is extremely unlikely that any semiconductor vendor will provide you with die area information.  This is highly proprietary information.  Might I ask what you are trying to achieve with this information?  Perhaps we can support you in some other way.

    I can confirm that the TMS570LS20216 product is built in a 130nm process technology.  The TMS570LS3137 is built in a 65nm process technology.  Both of these points are disclosed in the product safety manuals.

    Best Regards,

    Karl 

  • 0 in reply to KGreb
    Intellectual 920 points

    Hi Karl,

    The die size is the main piece of information I'm after. Though, I’m currently gathering information to assess the variation in design date, fabrication process and die size of currently available devices to see how the industry is evolving i.e. through design innovation, increase in design complexity (die size) or fabrication process.

    Do you have any further information you could provide regarding the TMS570 series?

    Regards

  • 0 in reply to Alan Day
    TI__Mastermind 23000 points

    Hello Alan,

    I'm afraid it is not so clear what you are looking for.  If you are looking for general industry direction, have you consulted ITRS (International Technology Roadmap for Semiconductors)?

    Best Regards,

    Karl