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Solder Stencil Thickness for TMS5703137ZWT

Tom McKinney

Prodigy 560 points

Please confirm if there is a recomended solder mask stencil thickness for the TMS5703137ZWT. In a TI document titled “Flip Chip Ball Grid Array Package Reference Guide” (Literature Number: SPRU811A, May, 2005) the table on page 20 lists the stencil thickness at 150mm which is too thick. The customer feels the stencil thickness should be around 0.15mm.

Please let me know if there is a document that specifies this requirement.

Thanks,

Tom

over 11 years ago

0 John Hall over 11 years ago

TI__Genius 9015 points

Hello Tom,

I have forwarded your question to one of our experts and they should respond soon.

0 Tom McKinney over 11 years ago in reply to John Hall

TI__Prodigy 560 points

John,

Any feedback on this post.

Thanks,

Tom

0 John Hall over 11 years ago in reply to Tom McKinney

TI__Genius 9015 points

Tom,

Sorry for the late response. I was on vacation last week. I will try again to get an answer to your question.

0 Anthony F. Seely over 11 years ago in reply to John Hall

TI__Guru 68930 points

Tom,

We're using an nFBGA package, not a flip-chip BGA.

There's a TI document SPRAA99 that lists 0.15mm solder stencil thickness for NMSD pad type and 0.8mm pitch.

See Fig. 6.

0 Tom McKinney over 11 years ago in reply to Anthony F. Seely

TI__Prodigy 560 points

This did answer my question. I cannot find the green button you refer to in your post.

-Tom