I am using TM4C123GH6PM for my recent project. I have made all the required connections as per the launchpad's user guide and datasheet. But whenever i apply 3.3v from the regulator, the ic gets heated. Please give me the solution. thank you.
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I am using TM4C123GH6PM for my recent project. I have made all the required connections as per the launchpad's user guide and datasheet. But whenever i apply 3.3v from the regulator, the ic gets heated. Please give me the solution. thank you.
Hello Dhaval,
The IC is bound to get heated based on the activity. Can you put a digital thermometer on the TM4C123 to see what the temperature is?
Also what kind of application are you running and by any chance are you using the GPIO's to power up an external device?
Regards
Amit
Dhaval Dave said:I am using TM4C123GH6PM for my recent project. I have made all the required connections as per the launchpad's user guide and datasheet. But whenever i apply 3.3v from the regulator, the ic gets heated. Please give me the solution. thank
Hi, please specify some detail:
Are you using a chip on your hardware or Launchpad?
Which IC get hot?
can you measure current drained from board regulator, IC or something to have an Idea of what is happening?
We can help for a solution, but the solution need more and more details.
Hi Amit,
Thank for your reply
.I have made my own PCB. Here I have attached its Schematic.
The problem with it that TM4C123 gets hot when I gave it 3.3v supply.
I have checked all connection, they are same as per launchpad.
I have also check power supply output before solder TM4C123. I haven't solder any other component except Controller and power supply component.
Also I have tried with external supply 3.3v.
please let me if I have made any mistake .
Regards,
Dhaval4442.V Sync.pdf
Hello Dhaval,
The issue is that the VDDC Pin has been shorted to the VDD Pin. The VDDC pin is an output from the TM4C123 and is 1.2V. By connecting a 3.3V to the pin through a regulator, you are causing the core to go 3.3V instead of 1.2V.
The VDDC pin should have been connected to ~3.0uF of decoupling capacitor only.
Regards
Amit
Might you share with us your MCU's ability to "recover" from that connection mistake? From memory I recall numerous others - guilty of similar - but rarely is the outcome presented...
Further - what caused you to note the "heating" of the MCU? Had you tried to download code - and failed?
"Measuring" cmos component temperature via, "your finger" indeed proves handy - but may subject the MCU to punishing (sometimes fatal) ESD events - thus is not especially recommended...
cb1- said:Further - what caused you to note the "heating" of the MCU? Had you tried to download code - and failed?
Hi CB1, from schematic there where direct connection to VDDC core pin and +3v3 supply, may be interesting to have feedback if processor survived to this shocking treatment. MSP430 due to an error on some board survived over 6 volt noticed not from overtemp but overcurrent.
Roberto Romano said:Hi CB1, from schematic there were direct connection to VDDC core pin and +3v3 supply
Oui, oui mon ami - indeed. But poster/user created that direct connection due to lack of full tech awareness. I'm asking simply, "What led him to "touch" the MCU - to discover heat build-up?" (and unstated - always - how does he compare that "touch" w/the normal/customary touch resulting from contact w/a correctly connected/behaving MCU?)
Appears that you/I (perhaps others - and that poster) would benefit from "what drove him" to perform such test?
Note that vendor rep here appears to, "sanction" such, "Touch as correct/proper - scientific test method!" As you/I/(and vendor) know - such "touch" is not normal/customary nor adequate - most likely subjects the MCU and/or adjacent board devices to ESD. (which does not always result in immediate failure - but too often weakens the IC - leads to issues downstream!)
A true, "teaching moment" registered here - was missed - those following/reading may thus be encouraged to adopt such, "unwise/unsafe" methods. Some boards - at some time - may include HV - a misplaced "touch" there may cause injury to those adopting this, "abnormal/incorrect/unsanctioned" (except for here) "test via touch" method.
Best time to make such corrections is as they occur - "passing" serves as tacit encouragement - and likely motivates others to adopt such "bad practice!" (someone had to so memorialize...) {10x points - that word - this close date!}
Well the ic is in working condition after the modification. I downloaded the code and it works properly. No heating after all.
I am very glad that at the very beginning of my career, you guys are very helpful and take interest in solving such silly mistake.!!!
Thank u all!!!
Good for you - glad the MCU survived - these do prove to be pretty hearty beasts.
What led you to "touch" (or employ other "temp. measure" method) the MCU? Other poster and my group always test/verify new boards via a "current-limited" power supply - with the current set to just above what is "normal/expected." In this way - often board/device destruction may be minimized. (even prevented)
Again - what led you to test/measure the MCU's temperature? Believe that's of interest to many.
A good first project may be your build of an external (low cost) temperature sensor - which is "interrogated" by your new (still surviving) MCU. Then - you may bit, "more conventionally" measure the temperature of other parts - with far less chance of ESD. A proper - and properly grounded - ESD wrist strap may also prove wise...
@cb1
well i always touch the ic, as i was told to do so, whenever d supply is on. in the development stage there might be an unintentional human error. In this task, i felt such heating and came to know something was going wrong. within a moment i removed the supply. And i could save the chip!!! :D :D :D
Dhaval Dave said:Well the ic is in working condition after the modification. I downloaded the code and it works properly. No heating after all.
Happy to read this, I/O is not so fault tolerant to short circuits or overloading, core instead appear to be tolerant to short exposure.
Touch the IC or terminal or handling and unsoldered chip require some attention to avoid ESD issue. Before measure the surface use another finger to touch a grounded plane then touch the other part. (Grounded to uC ground not earth, discharge to a nail or sharp edge may be more fast and you get pinged too)
Never wear syntetic cloth on electronic lab (may be a good reason not to wear at all).
Use electrostatic shoe and you can avoid a lot of trouble expecially on pc where you discharge thru keyboard and mouse.
Dhaval Dave said:as i was told to do so,
Forgot.... and not .... Mmmmhhh, in my experience form early age I still remember finger with a burned surface touching a to39 metal can transistor... If you wish use your finger try a short touch or better umidify finger surface again in a short touch before to leave finger in position.. Learn to save your finger and don't use like a voltmeter ;)
Nowaday it can be better to use a non contact thermometer it cost no much more than a contact one, is faster and avoid ESD too.
Dhaval Dave said:hahahahaha!!!! :D :D :D
Hey this is a serious PWM power lesson, finger get heat proportional to time it is in touch, so touch a VERY short while, then (Low duty cycle) then raise on time till 100% duty cycle if comfortable!
Touch without pressure, it reduce surface and transmittance...
Don't laugh too much and enjoy for life, when your time to touch an overheated to39 metal can or get solder iron hot surface tip than handle, this appeared seldom in my life but missing skin and pain at early age help remember for a LONG time!!!