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TMS570LS3137 BGA Package soldering technique

Lorenz Gruebler
Expert 1075 points
Other Parts Discussed in Thread: TMS570LS3137

Dear Forum,

Are there any disadvantages if the TMS570LS3137 BGA (CZWT Type) is soldered using a leaded precess?

regards,

Lorenz

  • 0
    TI__Mastermind 23000 points

     Hi Lorenz,

    Copying my response to your same question on the SafeTI private E2E.  Let's continue the discussion here and close that one.  

    I spoke with one of our reliability engineers and he had the following comments:

    • TI does not recommend to mix leaded and lead-free metallurgy
    • All of the TI reliability studies associated to the product are based on using the recommended lead-free solder and solder profiles
    • If metallurgy is mixed, TI cannot guarantee datasheet performance characteristics for the package
    • Industry studies have showed various results with mixed metallurgy - in some cases there were no issues, but in some cases issues were seen (such as the leaded solder temperature not being hot enough to fully melt the higher temperature lead free balls)
    Regards,
    Karl