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SM 470R1B1M-HT HQF Package -- Layout Questions

Chris48273
Prodigy 20 points

Other Parts Discussed in Thread: SM470R1B1M-HT

Hello,

there isn't a TM470 forum so I write in this forum.
I have a question about the layout and the package of this special device.
In the datasheet, here a link: http://focus.ti.com/lit/ds/symlink/sm470r1b1m-ht.pdf   leads aren´t shown.

The TI SM470R1B1M Mikrocontroller in an HFQ Package has a Ceramic Quad Flatpack with NCTB.
On an other TI page I found the Ceramic Quad Flatpack (S-CQFP-F84): http://focus.ti.com/lit/ml/mcfp015/mcfp015.pdf

Now my question: Are the dimensions for the leads I found in the S-CQFP-F84 datasheet the same as in the package with NCTB?
Unless, please can you give me the dimensions from this controller for my layout draft?
Are there more informations about the design of a circuit board for this controller and high temperatures?

This controller will be used in  an ambient temperature from 200 degree.

best regards

chris

  • 0
    TI__Guru 62930 points

    Chris,

    The HiRel group does not have an external E2E forum.

    Please send me an email at w a d e v b at ti. com

    (no spaces)

    Our team will address your questions.

    Regards,

    Wade

  • 0 in reply to Wade Vonbergen
    TI__Guru 62930 points

    I am directly in contact with Chris, but am posting here to close out the forum post with answer.

    The HFG package is considered an Non-Conduction Tie Bar (NCTB).
    The use of the NCTB package facilitates testing and manufacturing.  Once devices are shipped to customers, they are trimmed and formed to a footprint.  This footprint is somewhat dependent on what you need and how you specify to the vendor who does the trim and form operation.
    I have attached a power point presentation that discusses the use of the hermetic packages.

    Regards,

    Wade