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Required PCB Layer Stack-up for TMS570LC4357 Micro controller

Other Parts Discussed in Thread: TMS570LC4357

Hello TI,

Can you tell me the recommended PCB Layer Stack-up for TMS570LC4357 Micro controller for reduced EMI radiation and better performance??

1. I am looking for 8-Layer PCB layer stack-up

2. i am using Flexray, CAN, LIN, Ethernet, EMIF and Debugger Interfaces

  • Hello Nandhakumar,

    I'm not sure how much of help we can offer you with the information you have given above.

    Nevertheless I'm checking with few of our Hardware design experts to see if they have any comments here.
  • I assume all the power currents are on a single layer, one voltage or multiple voltage are segmented on the plane. The following PCB stackups are pretty common for high signal integrity:

                        #1                  #2

    Layer 1     GND              Signal

    Layer 2    Signal            GND

    Layer 3    Signal            Signal

    Layer 4    Power            Power

    Layer 5    GMD              GND

    Layer 6    Signal             Signal

    Layer 7    Signal             GND

    Layer 8    GND               Signal

    Regards,

    QJ

  • Thanks for the info... its very useful for us...