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tm4c123gh6pmi populating or soldering in custom board

Hello everyone,
It's my first time asking a question here, I design a custom pcb for a school project, but I have solder at least 4 MCUs in the board with no success, I have tried with solder wire but I think the temperature is too high with the soldering pencil, then I tried with hot air at 150° but it seems not to work very well with the solder paste I have. I just populated a 3.3v regulator, some decoupling caps, and the caps for VDDC, when I energize the board the VDDC voltage is too low, no voltage in my opinion, and the LM Flash programmer as the CCS are unable to detect my board (JTAG interface with a launchpad).
I really would like to know what technique and materials are used in populating the tm4c123gh6pmi in the launchpad, or what do you recommend me to get my system working.
Thank you very much.

  • Sorry, I forget to mention that the Reset and Wake signals pull ups are populated too. Hope you can help me. Thank you
  • Feel your pain - what you're attempting is not easy (usually) for those w/out great experience & equipment.

    Should your school project be, "Held hostage" to your creation of a difficult, custom pcb?   Really?

    May I suggest that you confine your "custom board creation" to the added accessory chips & components (not present on the LPad) - which justify your efforts toward a custom board?    And then use the low cost Launch Pad to "plug-in" to the custom, "Alex board."   In this manner you've eliminated the difficulty of successfully soldering the fine pitch MCU - yet you retain those extra features/capabilities - which you (appear) to need.

    Many have gone this route. (to include my firm - and we're blessed to have "pick-n-place" (automated placement of smt devices) and 20' long, multi-stage, reflow oven.)

    It's hoped that your ability to "problem solve" w/the MCU - not (solder) the MCU - should be central to your school project!   

  • Hello, and thank you for the fast answer.
    I have done that in the past, but this is a final project for 2 classes, PCB design and embbeded operating systems, and one of the requirements is that everything should be in one board (for PCB design). that's why I need to solve it this way. Any idea?
  • alex ruiz1 said:
    Any idea?

    Yes - but not sure (you) or vendor here will like them.

    First - as ALL students operate under such requirement (not too bright - IMO) cannot you have one of those students who produced a "working MCU" assist you?

    In the past - when the LM3S (earlier family of MCUs) walked here - 48 pin devices were available.   And these were easier to hand-solder than the far larger devices - now the only ones supplied.   Of note - other MCU vendors produce 48, 32, even fewer pin count ARM MCUs - which prove far easier to hand solder.  (the 32 pin QFP enjoys 0.65mm pitch - far easier to solder than 0.50mm!   Smaller ARM MCUs may have even wider pin pitch!)

    When hand soldering - liquid FLUX - and more liquid FLUX - prove immensely helpful.

    I've co-founded - taken past tech firm public.   I believe your instructors are (hugely) misguided to force pcb solder of fine-chip MCU upon you.   My firm hires many recent grads - and never/ever would we ask them to do such - NEVER!   As I stated earlier - IMCO (considered) those instructors are "HOLDING YOUR LEARNING HOSTAGE" due to an unjustifiable demand (fine pitch MCU soldering) which has NO place in a competitive, modern tech world!

  • I understand your point and my instructors was almost the same, but I went by an ambitious project, the suggested was to use a small 8 bit MCU MSP430, and do a very simple PCB and app (for pcb classes) but I just wanted to try this. I think I will get low temp solder paste and try again. I based the basic MCU system in the launchpad and add just what I need, also routed some pins that are not in the launchpad as I want to use almost all pins. Let me try that and I will post my result.
    The biggest concern for me is the handling of the MCU, how to manipulate it and populate it. but let's try.
    Thank you.
  • You are your project's boss - and I wish you well.

    Realize though - the time/effort/anguish spent "mastering fine pitch, MCU soldering" necessarily detracts/subtracts from the time/effort you'll have to do the real design & application solving - w/in your project. That "design & application" proves most important - does it not?

    I would bet you - that your presentation of your (failed) MCU board (to prove that you've tried) ALONG WITH your working LPad which plugs-in to your "Alex board" would prove acceptable - under the conditions I've noted.   (at least ask the instructor - blame me - try to win his/her support!)

    My fear - developed over many years of work in this field - is that your MCU may prove "intermittent" due to your lack of experience in board layout & fine-pitch assembly!     And that is "head of the class" Krazy Making!    And almost guaranteed for those in your position - and under deadline.

    Use of the LPad - plugging into your pcb - (after approval by the instructor) is SURE to produce a better, faster and SAFER result.

  • Absolutely agreed. Hand soldering fine pitch is a learned skill and required steady hands and good conditions. It addition to plenty of flux you must have a good solder mask.

    Hopefully you have ordered boards with a HASL finish, in which case the solder from that finish can help tack into place.

    If you can make friends with a local PCB rework wizard, they may be able to give you some useful pointers.

    Robert

    If it fits your cost and course requirements you might also see if a local board house would populate the fine pitch part.
  • Oh, and beep out a bare PCB. Make sure you don't have an unexpected short or open.

    Robert
  • Friend Robert's excellent post & pointers triggers (another) tip. His mention of the HASL finish reminds me of the great advantage provided by your soldering two - opposite corner MCU pins - first!   Insure that the MCU is exactly aligned (you may have to tape it down - or have an assistant hold it down in an "ESD approved" manner) and only solder one corner pin.  If successful - repeat that soldering procedure upon the MCU pin diagonally opposite the first pin (just) soldered.

    With that done - and provided you do not disturb either of those two precious (MCU aligning) joints - soldering the remaining pins has far higher chance of success. Liberal use of flux - and perhaps "dragging" your iron across multiple pins (often pin to pin shorts result) will enable many acceptable joints.  When shorts evidence - most always use of "solder wick" can remove the short - yet enable the MCU pin to still be connected to the pcb. (most always)

    Still the strong suggestion is NOT to attempt this. It will be challenging enough to fully/properly develop, debug & program your application.  Few firms are interested in employing new grads to, "Solder fine pitch devices - by hand."   They are interested in your ability to task the (properly) soldered MCU to solve problems - realize functions - and meet program objectives.   (hand soldering is "in the noise" - it is simply, "retarded!")

    Horse & buggy - along w/"hand soldering" of fine pitch parts - (should) have, "Left the building."

  • Hello Alex

    What kind of solder tip are you using, what is temperature setting of the tip and what is the gauge of the solder wire being used? Did you check for semi-solid solder paste instead of using a solder wire.

    Regards
    Amit
  • Oh well Robert - at least two out of three here have argued against the attempt to, "Reinvent a perfectly sound wheel!"   (i.e. the LPad)

    Days have already been lost in this (misguided) effort AND intermittent solder joints or cracked/fractured solder traces will wreak havoc.   Why risk that?

    Trying to do that for which you're: unprepared - little skilled - and have failed at repeatedly makes NO sense.   Pity to see that encouraged - at least you/I have highlighted the misplacement of time/effort/and funds...

    Silent in all of this is the (very) likely MISS of the excellent write-up by this vendor - outlining, "How to build an MCU pcb correctly."   For a first-timer - under deadline - to get all of this correct/proper is (extremely) wishful thinking.    Seat on the top deck of the Titanic, anyone?

  • Hi Amit,

    I'm using a very fine tip at 200°c for solder wire (hard to get it melted), but I think is too hot, so I tried to do it with hot air at 145°c, with solder paste, but the solder paste is not for low temp, so I already ordered a low temp solder paste that melts at 138°c.

    The PCB is made by OSHPARK, so it's kind of fine finished

  • Hello Alex

    200C is way too low. I use a fine tip for Surface mount components up to SOIC package at 395C. Anything smaller than that like QFN and TSSOP, I go for a flathead solder tip with solder paste and a generous amount of flux on the pin and the pad before applying the paste and using the solder tip. Of course it takes some practice to get used to paste and flathead (and the cleanup with the wick and fine tip).

    Regards
    Amit
  • Ok, I'm a little bit worried because the datasheet, says the Tjmax temp is 150°c, and in my design the pads for the MCU are too adjusted, so there is no place for the tip to touch only the pad, so I have to touch the MCU pin too.
    In your opinion, is possible to do what I'm trying to?
    Thank you.
    Best regards
  • Hello Alex

    Tjmax is the transistor junction temperature and not the pin temperature. Of course you need to be careful not to keep the solder iron touching the pin for excessively long time. But during soldering such temperature for a short duration are OK.

    Regards
    Amit
  • Ok, thank you, I'll try latter and post the result.
    Best regards
  • Hello Alex

    I found a good video on how to solder QFP and QFN packages,

    www.youtube.com/watch

    Regards
    Amit
  • Hello Amit and all here.
    I just followed your advice, Tried to solder a new pcb with a new MUC with a good quantity of flux and the soldering iron at 260°c with solder wire. It worked very well, the board is working now. So the problem is solved now, thank you all for your time and advices.
    Best regards
  • Hello Alex

    And that adds to you skills and capabilities....

    Regards
    Amit
  • Glad to hear, always worries me when something like that is on the critical path.

    Robert
  • While we (hope) that your problems are solved - it is unlikely that a full & proper test of all MCU signals was completed. In addition - as a "first ever" board creation - hairline fractures & intermittent solder joints are NOT uncommon!

    As small biz operator - holding your ongoing project work "Hostage" to the creation of an "iffy" board - is not a path we'd (ever) take!

    Should your board (appear) to work today - but fail or prove unreliable downstream - how will you (quickly & efficiently) differentiate between code error and hardware issues? (I don't believe that you can - thus you've created a condition of "maximum randomness" which stands in High Violation of KISS!)

    Such prototype boards - and their projects - often receive extreme handling.   (everything is new)  Is this not likely to "stress" marginal joints - or introduce ESD - or suffer during (multiple) component changes/additions?

    KISS argues for, "One battle at a time" (minimize unknowns)  - never/ever admit/invite too many "unknowns" - all thrown together - w/hope as your guide...  We note that a robust, tried/true LPad has been bypassed in favor of a "first creation!"   If that's "best practice" my firm's manuals require serious revision...

  • Hello cb1-

    Might a microscope be a useful tool for inspecting the solder joints. In my experience, after cleaning the flux and washing it with alcohol, shows an irregular solder joints well under a scope.

    Regards
    Amit
  • Hi Amit,

    Yes - such specialized tools may help - yet there is a clear (& I believe even clever) analogy which best frames this thread.

    DRM is one means to code your MCU. However - it is little "tried/true/tested" and the complexity demands great investment of time & energy - and (still) the end result may prove unacceptable.

    Thus - DRM is to the API as "Poster's hand assembled pcb" is to a pro-designed/built LaunchPad.   One method is "sure/confirmed" - the other, "Headache in the making!"

    And that's (exactly) the road this poster has taken - producing a board which is "uncertain at best" - and "who knows what" - if he's unlucky.   Earlier I proposed that the poster - if he must - produce a simpler accessory board - which accepts the LPad as a, "Plug-In."   Fine pitch MCU soldering often weakens board traces & proves injurious (often) to some MCU pins.   And the degree of failure may be expected to grow - adding more pain/suffering...

    Recall this is a prototype - will be repeatedly flexed/handled - (perhaps even dropped) by several. That adds an unacceptable element of risk - and as poster is new at programming it will prove SO hard to recognize his (coming) difficulties & issues as software or his (essentially untired/tested) hardware creation.

    Instructors who forced this "gimmick" would be unwelcome in my shop - & that of most all small tech biz owners I know.   Pity!
    Violating KISS so strongly is like looking down the barrel of a misfiring cannon - the "Risk" clearly overwhelms (any) "Reward."

    Never/ever would my firm allow (worse encourage) a "rookie" - w/out adequate tools & training - to produce a pcb where the success of the project is tied (really it's "Held HOSTAGE") to the correctness & robustness of such a board!   That's just ASKING for trouble and "retards" - rather than "boosts" - important, focused MCU learning...