Hello.
I am using F035 Flash API for FEE(Flash EEPROM Emulation) on TMS470MF0660.
Although I executed all Flash API from Flash bank 0 to handle bank1 data,
I was aware that according to SPNU493E following API must be executed from RAM.
-Flash_Blank_B()
-setup_state_machine()
Furthermore, according to spnz185A using Flash_Blank_B() is affected following Errata. (We used old version Flash library)
SDOCM00104972: Flash_Blank_B() does not enter read margin mode properly
Now we are considering modifying our software so that it conforms to User Guide.
However, our prototype software was used in several years. And adverse behavior has never been seen through various tests including product endurance test.
I have to explain to concerned departments reason why our software should be changed.
Is it possible to provide detailed technical information about followings?
(1)
If Flash_Blank_B() is executed from flash(different bank from being operated), what adverse behavior may occur? And what condition dose it occur?
Reading past posts, I understood the read margin mode affect all flash banks so instruction codes itself are read in margin mode. I understood that’s not good and without proper usage TI cannot warrant Flash retention period described in datasheet.
When read mode is changed, it may causes CPU error? If so, is there possible it depends on production lot?
(2)
Errata(SDOCM00104972) says “Blank check may fail when the sector of flash was really blank. Sometimes this gives a data abort.”
If false fail or data abort happen, how does it happen? Randomly or deterministic?
(3)
If setup_state_machine() is executed from flash(different bank from being operated), what adverse behavior may occur?
Regards,